SK hynix, a major player in the memory manufacturing industry, is gearing up to enhance its advanced packaging capabilities ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

Last year saw the emergence of a new memory module standard called CAMM2, a flat alternative to the SO-DIMM sticks used widely in laptops today. The benefits of CAMM are clear: they're thinner than SO ...

Display driver IC backend specialist Chipbond Technology and memory modules backend and EMS service provider Orient Semiconductor Electronics (OSE) have formed a long-term strategic alliance to ...

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SMART’s XMM CXL ™ Memory Module is designed to meet capacity and bandwidth needs for server and data center applications and workloads NEWARK, Calif.--(BUSINESS WIRE)--SMART Modular Technologies, Inc.

Based on chip-scale packaging (CSP), a new lead-free DRAM stacking technology enables the design and manufacture of cost-effective, high-density DRAM modules for large servers, telecom switches, and ...

Of all the PC-related things to come out of CES this year, my favorite wasn’t Nvidia’s graphics cards or AMD’s newest Ryzens or Intel’s iterative processor refreshes or any one of the oddball PC ...

In recent years laptop memory has either come in the form of a removable SODIMM stick or been soldered to the motherboard. But Dell’s new Precision 7670 and Precision 770 mobile workstation laptops ...

JEDEC has published the JESD317: Compute Express Link (CXL) Memory Module Base Standard to simplify system design and ease device specification. JESD317 defines the specifications for interface ...

WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced its first shipment of the Company’s Dragonfly ® G3 system with the ...