TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
Apple is planning to overhaul its chip design for the 2026 iPhones, in a move that could mark the first time it uses advanced multi-chip packaging in a mobile device. It sounds complicated, but here’s ...
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