The technology to enable sampling and the need for more metrology and inspection data in a production setting have aligned just in time to address the semiconductor industry’s newest and most complex ...
New design tailored to semiconductor wafer shapes Streamlines pressure inspection in the wafer bonding processTokyo, June 8, ...
Silicon (Si) has been the focus of the semiconductor industry and the modern electronic industry for the last half-century. However, its surface properties remain a mystery. The properties of the Si ...
Every wafer test touch-down requires a balance between a good electrical contact and preventing damage to the wafer and probe card. Done wrong, it can ruin a wafer and the customized probe card and ...
As nodes shrink and throughput increases, low-amplitude motion is emerging as a critical but often overlooked factor in ...
A new technique measures free-form wafer shape, write Marco Franchi, Wooptix, and Leon van Dijk, Ronald Otten, Richard Van Haren, ASML. On-product overlay (OPO) is one of the most critical parameters ...
Line-scan vs. area-scan cameras. Key ingredients to the high-speed machine-vision system for inspection. How to synchronize the wafers with the camera. Optical semiconductor inspection presents ...
Imec and EV Group (EVG) have developed wafer-to-wafer hybrid bonding technology at 200nm Cu interconnect pad pitch demonstrated on a test vehicle with routable interconnects. In addition, a record ...
Korea University researchers have developed a machine-learning framework that predicts solar cell efficiency from wafer quality, enabling early wafer screening and optimized production paths. Using ...
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